True and false identification method for electronic components
The focus of our discussion is the difference between original and new products of electronic components (mainly related to chip identification methods):
Original goods and new goods, here the new goods refers to the refurbished parts or disassembled parts, is processed after processing and then sold as original equipment. The following methods can be easily helped to identify us.
1. We can see if the surface of the integrated circuit chip has polished marks. If it is polished, there will be traces on the surface of the chip. Some will coat the surface with a thin coating to make it look shiny and without texture.
2. We can see silk screen. Most of the current chips are laser-marked or printed on a dedicated chip printer, which is clear and difficult to erase. Refurbished chips are susceptible to corrosion by cleaning agents, and are illegible, uneven, and misplaced.
3. We can look at the pins. Any tin-plated pins that are as bright as "new" must be refurbished. Most of the pins of the original IC are darker in color but uniform in color, and there is no trace of oxidation on the surface.
4. We can see the device production date and the package factory label. The label of the original goods, including the label on the bottom of the chip, should be consistent and the production time should be consistent with the product, but the label of the refurnished goods without Remark is confusing and the production time is different.
5. We can measure the thickness of the device. Many original laser-printed refurbishments have to be polished to remove the original mark. The overall thickness of such a device will be significantly smaller than the normal size, which can be compared with the original or with a caliper.
The above are some simple identification methods, for reference only.